Low Temperature Anodic Bonding Glass Wafers

The National Institute of Standards and Technology (NIST) is conducting market research to identify potential vendors for low-temperature anodic bonding glass wafers. The specifications require glass wafers that enable low-temperature anodic bonding below 250°C, with a thermal expansion coefficient matching silicon within 20 ppm from 0-450°C. The wafers should be polished, 4-inch diameter, with a thickness of 0.7mm and 3mm available. NIST is interested in identifying manufacturers, their country of origin, typical lead times, and relevant specifications or data sheets. This is a Sources Sought notice, not a Request for Quotation, and the information gathered will help determine the acquisition method, potentially including a small business set-aside. The assigned NAICS code is 334516, Analytical Laboratory Instrument Manufacturing, with a small business size standard of 1,000 employees.